Description:
This thickened thermal conductive silica gel pad is designed to facilitate efficient heat dissipation between integrated circuits (ICs) and heatsinks. The pad's unique formulation of thermally conductive silica gel offers excellent thermal conductivity, effectively transferring heat away from sensitive components. Its soft and elastic properties allow it to conform to irregular or uneven surfaces, filling gaps and ensuring optimal contact for maximum heat transfer. By effectively conducting heat from the internal device to the metal shell or heatsink, this thermal pad helps to improve the efficiency, stability, and service life of heating electronic components.
Specifications:
- Operating Temperature: -40 ℃ – 200 ℃
- Material: Silica Gel
- Size: 10x10x6mm
Features:
- High Thermal Conductivity: 6.0 W/mK thermal conductivity ensures rapid and efficient heat transfer, quickly dissipating heat and preventing overheating.
- Wide Operating Temperature Range: Maintains stable performance across a wide temperature range of -40℃ to 200℃ without melting or degrading.
- Electrically Non-Conductive: Safe for use in direct contact with electrical traces and components, eliminating the risk of short circuits or damage.
- Durable and Safe: Non-toxic, odourless, anti-corrosive, wear-resistant, anti-static, fire-retardant, compressible, and provides excellent electrical insulation.
Package Included:
1 x 10x10x6mm Thermal Conductive Silicone Pad
